Overview
UPSIREN UTP-8 Thermal Putty is a high-performance gap filler designed for demanding electronic cooling applications. With a thermal conductivity of 14.8 W/mK, it serves as a flexible replacement for soft thermal pads, conforming to uneven surfaces and filling the tiny gaps that rigid pads simply cannot reach.
Its non-conductive, halogen-free and RoHS compliant formula helps prevent short-circuit risk while delivering stable performance under high-temperature working conditions. The tacky, moldable texture stays put during assembly and will not dry out over time, making it a reliable choice for PC modders, repair technicians and electronics builders.
Key Features
- Brand : UPSIREN
- Model : UTP-8
- Type : Thermal Putty
- Thermal Conductivity : 14.8 W/mK
- Net Weight : 10 grams
- Formula : Halogen-free, RoHS compliant, non-conductive
- Texture : Low viscosity, tacky and moldable
- Application : Auto-dispensing equipment and stencil screen printing
Highlights
- ✓ Fills gaps that rigid thermal pads miss, improving heat transfer on GPU, VGA and memory IC chips
- ✓ Non-conductive formula reduces short-circuit risk for safer installations
- ✓ Stays soft and will not dry out, keeping performance stable over time
- ✓ Moldable texture adapts to uneven and irregular surfaces
- ✓ Practical cost-saving alternative for rework and field repair projects
Usage
Ideal for replacing soft thermal pads on graphics cards, memory modules and other electronic assemblies. The putty compresses well to fill varying gap heights, making it suitable for PC modding, board-level rework and maintenance work.
Note that this product is not suitable for use as a CPU thermal compound.
In the Box
- UPSIREN UTP-8 Thermal Putty, 10 grams
Please Note
- Not suitable for use on CPU. Intended for GPU, VGA and memory IC chips.
