This fully cured thermal putty provides high-performance thermal management for electronic components. Its non-drying, low-viscosity formula offers excellent thermal conductivity and helps transfer heat away from CPUs, GPUs, graphics cards, IC chips, processors, and heatsinks.

The putty fully fills uneven gaps between components and cooling surfaces, providing better coverage and compressibility than standard thermal pads. It is suitable for computer repair, electronics maintenance, rework, field repair, automatic dispensing equipment, and stencil screen printing.

The electrically insulating formula offers reliable high- and low-temperature resistance, helping improve system stability, support smoother performance, and extend the service life of electronic components.

Product Specifications:

Product Type: Thermal Putty
Color: Pink
Thermal Conductivity: 13 W/mK
Thermal Impedance: Less than 0.025°C-in²/W
Density: 3.2 g/cm³
Concentration: 300 ± 10 1/10 mm
Instant Temperature Resistance: -50°C to 340°C
Operating Temperature: -50°C to 200°C
Net Weight Options: 10g, 20g, and 50g